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MC10SX1130 LED Driver
Description
The MC10SX1130 is high speed LED Driver/current switch specifically targeted for use in FDDI PMD and ANSI X3T9.3 FibreChannel 266 Mbits/s optical transmitters. The integrated circuit contains several unique functional blocks which makes it easily configurable for use with a variety of high performance LED devices. The part is fabricated using MOSAIC IIITM bipolar process. The logic is designed so that a data HIGH input results in the modulation current flowing through the IOUT pin to turn on the LED. The device incorporates open collector outputs with a capability of driving peak currents of 100 mA. Since the output current switching circuitry simply switches current between the complementary outputs, the dynamic switching demands on the system power supply are greatly reduced. In addition, because the design is pure bipolar, the device current drain is insensitive to the data pattern and frequency of operation. The LED drive current is adjustable through the selection of an external set resistor, RSET. In addition, to allow for open loop compensation for the LED's negative optical output power tracking over temperature, a circuit is included to provide an adjustable positive temperature tracking coefficient to the LED drive current. This is controlled through the selection of an external resistor, RTCO. The MC10SX1130 incorporates novel pulse stretching circuitry which is intended to compensate for the turn-on delay and rise and fall time asymmetry inherent in LED devices. The stretch circuitry can be used to pre-distort the input signal pulse width to minimize the duty cycle distortion of the transmitted optical eye pattern. The stretch circuitry supports three different selections of pre-distortion. This choice is accomplished through a unique `tri-state' input which can be left open, tied to VCC, or tied to VEE to determine the pre-distortion amount. The device provides a VBB output for either single-ended use or as a DC bias for AC coupling the signal into the device. The VBB pin should only be used as a bias for the MC10SX1130 as its current sink/source capability is limited. Whenever used, the VBB pin should be bypassed to ground via a 0.01 mF capacitor.
Features
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LED DRIVER
SOIC-16 D SUFFIX CASE 751B
MARKING DIAGRAM
10SX1130G AWLYWW
A WL Y WW G
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.
* * * * * *
Differential Data Inputs 300 MHz Operation 100 mA Peak Drive Current Extremely Low Jitter Duty Cycle Distortion Compensation Adjustable Output Current Tracking With Temperature
* * * * *
Thermally Enhanced 16-Lead SOIC Package 75 kW Data Input Pulldown Resistors +5 V or -5.2 V Operation VBB Reference Available Pb-Free Packages are Available*
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
January, 2006 - Rev. 3
1
Publication Order Number: MC10SX1130/D
MC10SX1130
VEE Stretch VEE 16 15 14 IOUT RSET IOUT 13 12 11 VCC 10 VEE 9 DIN DIN ECL BUFFER Stretch IOUT IOUT
PULSE WIDTH ADJUST CIRCUIT
VBB 1 VEE 2 VCC 3 VBB 4 DIN 5 6 7 8 DIN RTCO1 RTCO2 VEE
BIAS CONTROL RTCO1 RTCO2 RSET
Figure 1. Pinout: SOIC-16 (Top View)
Figure 2. Block Diagram
Table 1. PIN FUNCTION TABLE
Pin DIN IOUT STRETCH Differential data inputs. Differential open collector outputs. Control input to select the amount of duty cycle pre-distortion. When the pin is left open, no pre-distortion is introduced. If the pin is connected to VCC, the output LOW state current pulse width is increased by 155 ps. When it is connected to VEE, the current pulse width is increased by 310 ps. Resistor to set LED drive current. This resistor sets the tail current of the output current switch and should be connected to the VEE plane. Since the RSET voltage compensation circuit is referenced to VEE, the RSET voltage will track 1:1 with VEE changes, thus the voltage across the RSET resistor will remain constant. Terminals for positive temperature tracking resistor. This resistor controls the temperature tracking rate of the voltage at the RSET pin, which in turn sets the LED drive current tracking. If the two pins are shorted together, the nominal tracking rate is 1.4mV/C and when a 2 kW resistor is connected across the pins, the nominal tracking rate is 4.9 mV/C. Most positive power supply input. +5 V for PECL operation or ground for standard ECL operation. Most negative power supply input. Ground for PECL operation or -5.2 V for standard ECL operation. Reference voltage for use in single ended applications or when the input signal is AC coupled into the device. Function
RSET
RTCO1, RTCO2
VCC VEE VBB
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SUPPLY DECOUPLING CAPACITORS +5.0 V
10 W
10 W
16 VEE
15 Stretch
14 VEE
13 IOUT
12 RSET
11 IOUT
10 VCC
9 VEE
VEE 1
VCC 2
VBB 3
DIN 4
DIN 5
RTCO1 6
RTCO2 7
VEE 8
PECL BIAS
50 W IN IN
50 W
1 kW PECL BIAS
Figure 3. Typical +5 V Applications Circuit
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol VEE VI Iout TA VEE Power Supply (VCC = 0 V) Input Voltage (VCC = 0 V) Output Current Continuous Surge Parameter Value -7.0 to 0 0 to -6.0 100 110 -40 to +85 -5.5 to -4.5 Unit VDC VDC mA C VDC
Operating Temperature Range Operating Range (VCC = 0)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
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Table 3. DC CHARACTERISTICS (RTCO = 1 kW 5%, RSET = R at IOUT = R at IOUT = 10 W 1%,
Unless Otherwise Noted)(Note 1)
-40C Symbol IIH IIL ICC VIH Characteristic Input HIGH Current (DIN, DIN Pins) Input LOW Current (DIN, DIN Pins) Quiescent Supply Current (No Load on RSET Pin) Input HIGH Voltage (Note 2) VCC = 5.0V, VEE = GND VCC = GND, VEE = -4.5 to -5.5V Input LOW Voltage (Note 2) VCC = 5.0V, VEE = GND VCC = GND, VEE = -4.5 to -5.5 V Output Reference Voltage (Note 2) VCC = 5.0 V, VEE = GND VCC = GND, VEE = -4.5 to -5.5 V Output Voltage at RSET Pin VCC = 5.0 V RTCO = Short VEE = GND RTCO = 1 kW RTCO = 2 kW VCC = GND (Note 3) RTCO = Short VEE = -5.2 V RTCO = 1 kW RTCO = 2 kW IOon IOoff VTR Output `ON' Current (IOUT, IOUT Pins) Output `OFF' Current (IOUT, IOUT Pins) VSET Tracking (Note 4) Short Between RTCO1 and RTCO2 1 kW Between RTCO1 and RTCO2 2 kW Between RTCO1 and RTCO2 30 0.5 12 17 24 Min Typ Max 200 0.5 12 17 24 Min 0C Typ Max 200 0.5 12 18 24 Min 25C Typ Max 200 0.5 12 19 24 Min 85C Typ Max 200 Unit mA mA mA mV 3770 -1230 4110 -890 3830 -1170 4160 -840 3870 -1130 4190 -810 3940 -1060 4280 -720 mV 3050 -1950 3500 -1500 3050 -1950 3520 -1480 3050 -1950 3520 -1480 3050 -1950 3555 -1445 mV 3570 -1430 3700 -1300 3620 -1380 3730 -1270 3650 -1350 3750 -1250 3690 -1310 3810 -1190 mV
VIL
VBB
VSET
600 430 230 -4400 -4570 -4770 75 50 30
635 515 355 -4365 -4485 -4645 75 50
610 570 470 -4390 -4430 -4530 30
690 650 550 -4310 -4350 -4450
770 730 630 -4230 -4270 -4370 75 50 30
775 855 845 -4225 -4145 -4155 100 50 mA mA mV/C
1.4 3.4 4.9
1.4 3.4 4.9
1.4 3.4 4.9
1.4 3.4 4.9
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. 10SX circuits are designed to meet the DC specifications shown in the table after thermal equilibrium has been established. The circuit is mounted in a test socket or mounted on a printed circuit board and transverse air greater than 500 lfm is maintained. 2. Note that in PECL applications, VIH, VIL, VBB will vary 1:1 with the VCC supply. 3. VSET tracks 1:1 with the VEE supply to maintain the same voltage across the RSET resistor. 4. VTR tracking measures the rate of change of the VSET voltage over temperature.
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MC10SX1130
Table 4. AC CHARACTERISTICS (RTCO = 1 kW 5%, RSET = R at IOUT = R at IOUT = 10 W 1%, Unless Otherwise Noted) (Note 5)
-40C Symbol tPLH, tPHL tStretch Characteristic Propagation Delay (Differential) to Output (Single-Ended) Propagation Delay Stretch = OPEN Stretch = VCC Stretch = VEE Rise Time Fall Time Rise Time Fall Time Jitter Bandwidth Duty Cycle Skew Minimum Input Swing Common Mode Range (Differential) (Note 9) (Note 10) (Note 11) 150 -0.400 See 7 Square Wave Input Pseudo Random Input (Note 6) Condition Min Typ 1300 1300 0 145 300 600 375 490 260 9 10 300 400 30 150 -0.400 See 7 300 Max Min 1000 950 120 250 510 330 360 220 0 to 85C Typ 1400 1400 0 155 310 880 550 600 500 6 15 400 30 Max 1800 1850 200 380 1260 860 850 750 Unit ns ps
tr 10-90 tf 90-10 tr 20-80 tf 80-20 Jitter BW tSKEW VPP VCMR
10% to 90% 90% to 10% 20% to 80% 80% to 20% (Note 7) (Note 8)
ps ps ps MHz ps mV V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. 10SX circuits are designed to meet the AC specifications shown in the table after thermal equilibrium has been established. The circuit is mounted in a test socket or mounted on a printed circuit board and transverse air greater than 500 lfm is maintained. 6. When the Stretch function is used, the output low pulse width is increased by the specified amount. 7. Test condition uses a 133 MHz 50% duty cycle signal. 8. Test condition uses a 266 Mbit/s input pseudo-random data stream (n = 23). 9. Duty cycle skew is the difference between tPLH and tPHL propagation delay through a device, Stretch input is left open. 10. Minimum input swing for which AC parameters are guaranteed. 11. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPP Min and 1.0 V. The lower end of the CMR range is dependent on VEE and is equal to VEE + 3.5 V.
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MC10SX1130
APPLICATIONS INFORMATION
Introduction
The MC10SX1130 is intended to be integrated into high performance fiber optic modules or used stand-alone to drive a packaged optical LED device. The wide frequency response of the device allows it to be used to support a variety of digital communication applications ranging from: * OC1/3 SONET/SDH Links * 100 MBit/s FDDI * 155 MBit/s ATM * 133/266 MBit/s FibreChannel To support such wide ranging application areas, the LED Driver incorporates a variety of unique features. These offer designers added flexibility that could not previously be realized in less integrated designs.
LED Characteristics
LED devices emit light when forward biased. The optical power emitted by an LED is determined by the amount of current flowing through the device. This relationship is a relatively linear function of the current, until the device saturates. In some ways, an LED device behaves much like a traditional small signal silicon diode, although the forward "ON" voltage of an LED is much larger and ranges from 1.0 V to 2.0 V. In addition, for a fixed amount of current, the optical power from the LED will decrease if the device junction temperature increases. Another behavior of most LED devices is that they have unequal turn-on and turn-off times. In developing an LED transmitter, the designer must wrestle with all these behaviors to develop a product that meets the design targets.
LED Driver
The MC10SX1130 LED Driver accepts a digital binary data stream which is processed by the driver circuitry to create a current waveform to modulate the LED device. The LED Driver contains circuitry to program the modulation current, pre-distort the input waveform to partially compensate for the LED turn-on/turn-off delay, and compensate for the negative optical output power tracking co-efficient. The LED Driver operates from a +5 V supply for PECL applications or a -5.2 V supply for traditional ECL systems. For further information on PECL, please consult "Designing with PECL Application Note", AN1406/D available from a ON Semiconductor representative.
Circuit Blocks
The data input circuitry has been realized as a traditional differential ECL line receiver. It can accept either differential 100K or 10KH style ECL or PECL depending on the supply voltage used. In addition, a VBB reference is provided for use in single ended applications. This reference is useful if the input signal must be AC coupled into the device. The pulse stretcher provides two choices of duty cycle pre-distortion. It is controlled by the input STRETCH signal. When the pin is left open, no pre-distortion is applied to the input waveform. If the pin is strapped to the upper or lower rail, then the output waveform low pulse width will be increased. In a +5 V application, when the STRETCH pin is tied to +5 V, the nominal pulse width increase is 155 ps and when it is connected to 0 V, the nominal pulse width is increased by 310 ps. The bias control circuitry regulates the voltage supplied at the RSET pin of the output current switch. In addition, it implements a positive tracking circuit which provides open loop temperature compensation for the LED's negative tracking coefficient. An external resistor connected between the RTCO1 and RTCO2 is used to select the rate of voltage change at the RSET pin. The output current switch is the final stage in modulating the LED. The emitter of the current source is pinned out so that an external resistor can be used to set the modulation current. This circuit is implemented using a fully differential gate where both collectors are brought out. As the LED is modulated on and off, the current switches from one collector to another. This architecture minimizes the switching noise inherent in some LED driver design topologies where the modulation current is actually turned on and off.
Design Considerations
Some of the key sub-circuits in the LED Driver are listed below: * Input Line Receiver * Pulse Stretcher * Bias Control Circuitry * Output Current Switch
Once the user has selected an LED, the driver circuitry should be optimized to match the characteristics of the LED. The three circuit blocks previously described allow the user to control the pulse width adjustment, LED drive current and temperature tracking rate. A very simple example may best illustrate the design process steps. An LED has been selected which has the desired optical output power when modulated with a waveform of 65mA. In addition, the LED has an output power tracking coefficient of -0.5%/C. Thus for every 1C rise in the case temperature of the LED, the output power will decrease by 0.5% of the nominal value. In addition, the LED forward voltage is 1.5 V.
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MC10SX1130
First, the RSET resistor must be chosen to set the desired nominal modulation current based on the following equation:
RSET = VSET/IMOD (Equation 1) Thermal Management
The voltage at VSET is a function of the RTCO tracking resistor, so the desired tracking rate (VTR) must also be chosen. To determine this, the equation must be normalized to correspond to how the LED has been specified.
Temp Co = VTR/VSET (Equation 2)
LED devices tend to require large amounts of current for most efficient operation. This requirement is then translated into the design of the LED Driver. When large modulation currents are required, power dissipation becomes a critical issue and the user must be concerned about the junction temperature of the device. The following equation can be used to estimate the junction temperature of a device in a given environment:
TJ = TA + PD * qJA (Equation 3)
The data sheet has three temperature tracking rates for different values of the RTCO resistor. By using the VSET values at 25C and substituting those numbers into Equation 2, normalized tracking rates can be calculated.
Table 5. Normalized Tracking at 25C
RTCO Short 1 KW 2 KW Tracking %/C +0.20 +0.52 +0.89
Junction Temperature Ambient Temperature Power Dissipation Average Thermal Resistance (Junction-Ambient) A specially designed thermally enhanced leadframe has been used to house the LED Driver. Below is a graph of the average qJA plotted against air flow.
110
TJ TA PD qJA
To match the LED chosen, a 1 kW resistor can be used. Now that this is known, the value of the voltage at the VSET can be substituted into Equation 1 to determine the value of RSET resistor which, for this example is 10 W. The Stretch circuit can be used to compensate for the turn-on/turn-off delay of the LED. The circuit has been designed for ease of use so the pin is designed to be strapped to one of the two power plane levels to select the pre-distortion value. If no pre-distortion is desired, the pin can be left open. In this +5 V example, the maximum amount of pre-distortion is desired, so the STRETCH pin is connected to ground. In addition a resistor must be placed between IOUT and VCC. In selecting this resistor, just as in the case of the RSET, the resistor type should be chosen to dissipate the worst case power and derated for the worst case temperature. As a rule of thumb, the voltage drop across the resistor should match the forward voltage across the diode. The voltage can be larger to minimize the power dissipated on chip when the LED is not 'ON'. Although, the voltage drop across this resistor should not be greater than 2 V. For this example:
R @ IOUT = VF/IMOD IMOD(max) + VSET@85 C RSET + 855mV + 86mA 10W
100 JA ( C/W)
90
80
70
0
100
200
300
400
500
Figure 4. Typical qJA versus Airflow
AIRFLOW (LFPM)
The power dissipation of the device has two components; the quiescent power drain related to the pre-drive circuitry, and the power dissipated in the current switch when driving the LED.
Pd = Pstatic + Pswitching (Equation 4)
The power dissipated in the current switch is a function of the IMOD current, the LED forward voltage, and the value of RSET. For example in a +5 V application, the following equations can be used:
Pstatic = VCC * ICC (Equation 5) Pswitching = (VCC-VF-VSET)* IMOD (Equation 6)
R @ IOUT = 1.5V/86mA = 17W
Because of the positive tracking circuitry in the LED driver, the modulation current will increase over temperature. It is important to now go back and re-calculate the numbers under the worst case environmental conditions to ensure that operating conditions have not been exceeded.
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MC10SX1130
Now to calculate the dissipated power on the chip for a nominal application. =5V VCC VF = 1.5 V VSET = 0.7 V IMOD = 60 mA ICC = 18 mA so: Pd = 5 * 18 + (5 - 1.5 - 0.7) * 60 Pd = 258 mW This number can be entered into Equation 3 along with the environmental information to calculate the nominal operating junction temperature. Because of the open loop feedback control in the bias control circuitry, the revised IMOD value must be determined given the tracking rate chosen so that the power dissipation can be re-calculated. For assessing product reliability, worst case values should be entered to calculate the maximum junction temperature.
Reliability of Plastic Packages
performance failure of the affected pin. With this relationship between intermetallic formation and junction temperature established, it is incumbent on the designer to ensure that the junction temperature for which a device will operate is consistent with the long term reliability goals of the system. Reliability studies were performed at elevated ambient temperatures (125C) from which an Arrhenius Equation, relating junction temperature to bond failure, was established. The application of this equation yields the table of Table 6. This table relates the junction temperature of a device in a plastic package to the continuous operating time before 0.1% bond failure (1 failure per 1000 bonds) The MC10SX1130 device is designed with chip power levels that permit acceptable reliability levels, in most systems, under the conventional 500 lfpm (2.5 m/s) airflow.
T = 6.376 x 10 -9 e Where: 11554.267 273.15 + TJ
T = Time to 0.1% bond failure
Although today's plastic packages are as reliable as ceramic packages under most environmental conditions, as the junction temperature increases a failure mode unique to plastic packages becomes a significant factor in the long term reliability of the device. Modern plastic package assembly utilizes gold wire bonded to aluminum bonding pads throughout the electronics industry. As the temperature of the silicon (junction temperature) increases, an intermetallic compound forms between the gold and aluminum interface. This intermetallic formation results in a significant increase in the impedance of the wire bond and can lead to
ORDERING INFORMATION
Device MC10SX1130D MC10SX1130DG MC10SX1130DR2 MC10SX1130DR2G Package SOIC-16 SOIC-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free)
Table 6. TJ vs Time to 0.1% Bond Failure
Junction Temp. (C) 80 90 100 110 120 130 140 Time (Hrs.) 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time (yrs.) 117.8 47.9 20.4 9.1 4.2 2.0 1.0
Shipping 48 Units / Rail 48 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC10SX1130
PACKAGE DIMENSIONS
SOIC-16 D SUFFIX CASE 751B-05 ISSUE J
9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
-A-
16
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
MOSAIC III is a trademark of Motorola, Inc.
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